BRK Packaging and Assembly Core

Overview of Services  

The Birck Packaging and Assembly Core is a collection of tools designed to operate on the micro and macro scale.   The equipment includes a CPD, or Critical Point Dryer, typically used to free cantilevers on MEMS devices. Dicing saws cut semiconductor wafers into smaller pieces to free individual devices for packaging and testing. Wire bonders to connect the bonding pads on the devices to the pins of the packages they are mounted in. The LPKF Milling Machine, Press, and Plater are used for Rapid Prototyping of multi-layer printed circuit boards.

Leadership

Tim Miller, Research Engineer
miller@purdue.edu
765-494-3461

Location and hours of operation

Getting Started

**For Purdue individuals: First-time users should click "Sign-up" in upper right.  Returning students will click "Login"

**For Non-Purdue individuals: Before you register, you must be assigned a Business Partner Number and given Purdue credentials to register/login.  

Please contact the center manager for further information.

Links and Resources

1. Purdue University Discovery Park - Birck Nanotechnology Center  
2. nanoHUB
3. Purdue University - Purdue e-Pubs
4. Purdue University Discovery Park - Birck Nanotechnology Center, Research
5. BCN Safety Systems
6. Birck Emergency Plan
7. Birck Policy and Procedures Manual

Contacts