Wet and dry etch capabilities can be applied to almost any materials used in the cleanroom. Two deep reactive ion etchers (DRIE), two bosch silicon etchers, a simple reactive ion etcher, and an oxygen barrel asher anchor the dry-etching capabilities. Several conventional acid and solvent hoods, as well as two high temperature-acid hoods, provide space for wet etches and cleans.
Francis Manfred, Research Engineer
fmanfred@purdue.edu
Hours | Location |
Monday - Friday 9:00 am - 5:00 pm |
Birck Nanotechnology Center 1205 West State Street West Lafayette, IN 47907-2057 |
**For Purdue individuals: First-time users should click "Sign-up" in upper right. Returning students will click "Login"
**For Non-Purdue individuals: Before you register, you must be assigned a Business Partner Number and given Purdue credentials to register/login.
Please contact the center manager for further information.
Name | Role | Phone | Location | |
---|---|---|---|---|
Francis Manfred |
Research Engineer
|
7654943480
|
fmanfred@purdue.edu
|
2287B
|